Soar Technology Co., Ltd

The probe is the core part of the probe card, used for the interface between the electronic component and the testing machine, so that the wafer test can actually be tested. Probe usage: It is the core component of the probe card and is used as a connected component. It is tested separately by transmitting electrical signals to the pads of the chip to distinguish good products from faulty products Material: Tungsten (WNP), Rhenium Tungsten (WRNP), P4, P7, BC Specifications are customized according to customer needs Customized production can be made according to customer drawings and samples Stable quality and fast delivery Country of Origin: United States Processing place: Taiwan

In addition, as a very hard and compact material, tungsten is often made into high-density and high-hardness applications such as armored vehicles, aviation high temperature, heat sinks, and even ballasts for ships and airplanes. The tungsten needle is an ultra-sharp electrode made of refractory alloy for scientific instruments. The electrode has a blunt tip and a pointed bottom. It is composed of a refractory alloy with an ultra-large electrode method with a vertical axis of rotation. The molten oxidant can be removed and replaced cyclically. Pool pole.  

In addition, rhenium-tungsten probes also have the following characteristics: High melting point High hardness High plasticity High resistivity Low vapor pressure High conductivity Strong thermal conductivity

Probe beryllium copper is often used for low contact resistance or high current. Compared with other probe materials, its hardness characteristics are relatively low, so in terms of wear, it will be faster than other probes. Beryllium copper probes are classified into wafer bodies. Compared with traditional tungsten needles, the softness of beryllium copper probes is much higher and more flexible. Generally, beryllium copper probes are specially developed and manufactured for the LED and LCD industries. It is the best choice for customers with stable performance and effective cost reduction.