Soar Technology Co., Ltd

Used in the packaging of electronic products. This resin has good processability and stability. This product has good adhesion after hardening, and has good resistance to oleochemicals and solvents. It has low ion content and good storage stability, and can harden quickly at high temperatures. It has unique rheological properties and can be used as a resin for dam construction and filling at the same time. This resin has excellent durability and can pass many different environmental tests. This product has a high degree of reliability and durability, and is a high-performance adhesive for many applications. It has high viscosity and excellent thixotropy. During the process of processing and hardening, it will not sag freely. The surface of the hardened material will not appear greasy and low gloss. It has good dimensional stability in a considerable temperature range. The hardened material has an excellent protective effect and shock resistance to the components. The adhesive strength retained by this product after environmental testing is still good. The hardened material of this resin has good resistance to both gaseous and liquid moisture. This product complies with 2002/95EC RoHS regulations.

The high temperature resistant epoxy resin is composed of epoxy groups that can increase the crosslinking density of the molecular structure and a heat-resistant skeleton. After the epoxy resin molecular structure is cured, the epoxy resin groups are cross-linked due to the large internal stress and the molecular Epoxy construction. The high density and other reasons cause the adhesives' shortcomings such as brittleness, impact resistance, heat resistance, and fatigue resistance, which limit the application range of epoxy resin adhesives. For this reason, relevant scientific researchers in my country have done a lot of research on improving the preparation process of epoxy resin adhesive. For example, in the preparation of bisphenol ether type epoxy resin, since the epoxy group on its molecular structure is a complex three-membered heterocyclic ring, after the epoxy resin is cured, a large number of aromatic ring structures will be produced on its molecular chain, which will make the cured product The heat resistance decreases and the brittleness increases. Therefore, during the preparation process, scientists replaced the isopropyl group in the molecular structure of the bisphenol epoxy resin with the highly polar sulfone group, which can effectively improve the thermal stability and heat resistance of the cured epoxy resin. It has high viscosity and excellent thixotropy. During the process of processing and hardening, it will not sag freely. The surface of the hardened material will not appear greasy and low gloss. It has good dimensional stability in a considerable temperature range. The hardened material has an excellent protective effect and shock resistance to the components. The adhesive strength retained by this product after environmental testing is still good. The hardened material of this resin has good resistance to both gaseous and liquid moisture. This product complies with 2002/95EC RoHS regulations.

In addition to the chemical properties of epoxy resin being affected by its own structure, the curing agent is also one of the important factors affecting its heat resistance. Normally, the functional groups and chemical molecular structure of the curing agent react with the epoxy resin to produce The molecular structure, shape and performance of the cured resin will change accordingly. Therefore, a reasonable design of the cured product of the epoxy resin adhesive plays a vital role in optimizing the performance of the adhesive. When the epoxy resin undergoes a curing reaction, the epoxy group of its molecular structure will have a corresponding induction effect. Because the oxygen atom of the epoxy group on the epoxy resin molecular chain has a lot of negative charges, there is a carbon atom on the end of the group chain. There are many positive charges, so nucleophiles and electrical reagents all make the epoxy cured product undergo an addition reaction, and the epoxy resin molecules are ring-opened and polymerized. Such as alicyclic anhydrides, aromatic amines, dicyandiamide, silicone resins, aromatic rings, etc. The surface of the hardened material will not appear greasy and low gloss. It has good dimensional stability in a considerable temperature range. The hardened material has an excellent protective effect and shock resistance to the components. The adhesive strength retained by this product after environmental testing is still good. The hardened material of this resin has good resistance to both gaseous and liquid moisture. This product complies with 2002/95EC RoHS regulations.